Wearables: Tailoring Intel®

Edison Technology to Provide Expanded Benefits

Intel CEO Brian Krzanich introduced Intel® Edison at CES with a vision of bringing Intel Architecture performance, computing capability and Internet connectivity to new wearable and IOT devices. Scheduled for summer availability, Intel® Edison is a product-ready, general compute platform with built-in wireless for those who wish to create a wearable or small form factor device.

We have received an enthusiastic response from the pro maker and entrepreneurial communities, as well as consumer electronics and industrial IoT companies. And have decided that in order to best address a broader range of market segments and customer needs we will extend Intel® Edison to a family of development boards.

Notable enhancements include the use of the leading-edge 22nm Silvermont dual core Intel® Atom SOC; increased I/O capabilities and software support; and a new, simplified industrial design. This provides greater performance, increased durability and additional cost savings.

Silvermont: While we work to extend the Intel Quark SoC family with multi-core offerings, we’ve prioritized bringing the board powered by the 22nm Silvermont dual core Intel® Atom SOC to market first to best meet a broad range of market needs. Offering a dual core, dual threaded CPU at 500MHz with an additional MCU and over 30 I/O interfaces via a small 70-pin connector the product will offer solid performance for wearable or small form factor device creators.
Increased IO and software support: Intel® Edison supports existing, familiar IA-based programming tools and will be compatible with accessible developer tools used by the maker community, such as the Arduino* IDE and Wolfram Language. Intel plans to also add support for Yocto Linux, Node.js and Python. Intel® Edison will continue to be connected with Wi-Fi and Bluetooth LE* support.
With a new industrial design: Slightly larger than an SD card, Intel® Edison will provide more value for our customers by simplifying the design process for the companies creating the designs, increasing the durability and providing additional cost savings in comparison to building for an SD form factor.
Intel is moving at an accelerated pace with rapid innovation to address a variety of market opportunities. We believe the Intel® Edison family offers individuals and small, innovative companies a compelling platform to introduce smart and connected wearable and IOT products that will delight people in new and unexpected ways.

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